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Wafer Level Packaging Market 2022: Industry Share, Size, Trends and Forecast 2027

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According to the latest report by IMARC Group, titled, “Wafer Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027“, The global wafer level packaging market reached a value of US$ 4.0 Billion in 2021. Looking forward, IMARC Group expects the market to reach US$ 11.2 Billion by 2027, exhibiting a CAGR of 18.8% during 2022-2027.

Wafer-level packaging (WLP) is a technological solution that assists in adding protective layers and electronic connections to the substrate before dicing. It also aids in reducing the chip size, streamlining the process of manufacturing, and testing the functionality of the chip. Besides this, it minimizes the cost of electrical testing, manages the inventory and enhances the overall performance. As a result, WLP is extensively utilized in devices, such as pressure sensors and microphones, across the globe.

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Wafer Level Packaging Market Trends and Drivers:

The thriving electronics industry, in confluence with significant investments in the infrastructure, represents one of the key factors driving the market. WLPs provide enhanced mechanical protection, structural support, and extended battery life to the devices. As a result, the demand for these cost-effective and high-performance packaging solutions is escalating around the world. Furthermore, leading manufacturers are incorporating connected devices with advanced technological solutions, such as the Internet of Things (IoT), which is creating a favorable market outlook. Consequently, WLP is employed in the production of self-driving automobiles and numerous wearable devices worldwide. Besides this, there is a considerable increase in the demand for portable consumer electronic devices. This, along with the growing circuit miniaturization in microelectronic devices, and the rising need for compact and faster consumer electronics, is anticipated to positively influence the market.

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players.

  • Amkor Technology Inc.
  • China Wafer Level CSP Co. Ltd.
  • Chipbond Technology Corporation
  • Deca Technologies Inc. (Infineon Technologies AG)
  • Fujitsu Limited
  • IQE PLC
  • JCET Group Co. Ltd.
  • Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
  • Tokyo Electron Ltd.
  • Toshiba Corporation.

Wafer Level Packaging Market 2022-2027 Competitive Analysis and Segmentation:

The report has segmented the market based on packaging technology and end use industry.

Breakup by Packaging Technology:

  • 3D TSV WLP
  • 5D TSV WLP
  • WLCSP
  • Nano WLP
  • Others

Breakup by End Use Industry:

  • Aerospace and Defense
  • Consumer Electronics
  • IT & Telecommunication
  • Healthcare
  • Automotive
  • Others

Breakup by Region:

  • North America
  • Asia-Pacific
  • Europe
  • Latin America
  • Middle East and Africa

Ask Analyst for Customization and Browse full report with TOC & List of Figure: https://www.imarcgroup.com/wafer-level-packaging-market

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IMARC Group is a leading market research company that offers management strategy and market research worldwide. We partner with clients in all sectors and regions to identify their highest-value opportunities, address their most critical challenges, and transform their businesses.

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